Indium Corporation Announces High-Melting Pb-free Solder Alternatives Agreement with Ormet Circuits
Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.
This agreement enables Indium Corporation to offer a line of high-temperature, Pb-free (lead-free) assembly materials that addresses the requirements of many power semiconductor and semiconductor packaging applications. When Pb-free is a requirement, the only suitable high-temperature solder that exists is the AuSn eutectic alloy. These transient liquid phase sintering (TLPS) materials, which offer an alternative technology to solder, provide many of the assembly process advantages of a low-melting Pb-free solder combined with high-temperature joint stability.
Indium Corporation Global Product Manager Dr. Andy Mackie said, "Ormet is leveraging Indium Corporation's global sales and technical support capabilities to offer these products into the electronics assembly, passive component assembly, and semiconductor assembly markets. Indium Corporation is leveraging Ormet’s unique materials set. This combination ultimately benefits our customers and the marketplace.”
Headquartered in San Diego, CA, Ormet Circuits, Inc. was incorporated in 2003 to manufacture and market conductive pastes and inks for the printed circuit board fabrication and microelectronics industries. Ormet conductive materials find wide use in many electronic applications from radar antennas to semiconductor packages, complex circuit boards, and electronic components and assemblies.
Indium Corporation is a premiere materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.
This agreement enables Indium Corporation to offer a line of high-temperature, Pb-free (lead-free) assembly materials that addresses the requirements of many power semiconductor and semiconductor packaging applications. When Pb-free is a requirement, the only suitable high-temperature solder that exists is the AuSn eutectic alloy. These transient liquid phase sintering (TLPS) materials, which offer an alternative technology to solder, provide many of the assembly process advantages of a low-melting Pb-free solder combined with high-temperature joint stability.
Indium Corporation Global Product Manager Dr. Andy Mackie said, "Ormet is leveraging Indium Corporation's global sales and technical support capabilities to offer these products into the electronics assembly, passive component assembly, and semiconductor assembly markets. Indium Corporation is leveraging Ormet’s unique materials set. This combination ultimately benefits our customers and the marketplace.”
Headquartered in San Diego, CA, Ormet Circuits, Inc. was incorporated in 2003 to manufacture and market conductive pastes and inks for the printed circuit board fabrication and microelectronics industries. Ormet conductive materials find wide use in many electronic applications from radar antennas to semiconductor packages, complex circuit boards, and electronic components and assemblies.
Indium Corporation is a premiere materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
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